Glass Bonding

Adhesives for Electronic Assembly

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  • PARLITE UV/Visible Curable Adhesives
  • PARTITE Methacrylate Adhesives
  • PARBOND Epoxy Adhesives


PARLITE® UV/ Visible Cure Adhesives for Electronic Application

Parson offers wide range of UV, Visible and Multi-Cure adhesives for variety of electronic applications for bonding, potting, encapsulating, coating, tacking and sealing. Parson’s state-of-the-art research and development facility offers custom formulations to meet customer’s specifications and performance requirement. This brochure describes some of our most popular grades but there are many other grades available which are not listed here. These products are available in wide variety of packing such as syringe, bottle, and drum.



Conformal Coatings for Protection of Electronic Circuit Board

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Grade Substrates Viscosity @ 250C cps Shore Hardness Modulus of Elasticity psi Dielectric Strength volts/mil Application
4750 PCB Boards, Glass-Filled Epoxy, Ceramic, Metals 150 - 200 D80 - D85 60,000 - 70,000 1,700 - 1,900 Tough, glossy conformal coating with excellent adhesion to variety of PC boards and masks. Multicure with fast speed.
4753 Glass-Filled Epoxy, PCB Boards, Metals 2,200 - 2,500 D60 - D65 12,000 - 15,000 > 1,500 Medium viscosity; Multi-cure coating for wetting components, low modulus for enhanced thermal cycling performance.


Chip Encapsulants & Wire Bonders

Parlite line of encapsulants offers superior protection to flexible and rigid platforms. These high performance encapsulants are 100% solver free, electrically insulating, offers excellent thermal and moisture resistance.

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Grade Substrates Viscosity @ 250C cps Shore Hardness Elongation at Break % Modulus of Elasticity psi Color Application
4713 PET, Polyimide, Metals 4,000 - 5,000 D45 - D50 140 - 160 2,500 - 3,000 Clear Ideal for Chip on Board, Chip on Flex, Chip on Glass, Wire bonding, Bare-die encapsulation.
4716 PET, Polyimide, Metals, Glass 15,000 - 20,000 D45 - D50 140 - 160 2,500 - 3,000 Clear Higher viscosity version of Parlite 4713. Low modulus for wire bonding application.


Display Bonding & Laminating

PARSON manufactures wide range of UV/ Visible cure adhesives for optical display bonding and laminating applications such as touch panel assembly including bonding flat panel displays, touch screens, LCD screens, tablets, outdoor kiosks, navigation systems, liquid crystal displays, kiosk panels, mobile phones, and smart connected devices.

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Grade Substrates Viscosity @ 250C cps Color Refractive Index Tensile Strength Hardness Application
4721 Glass, LCD, Plastics 10,000 - 12,000 cps Clear 1.507 900 - 1,200 psi 60D - 62D LCD End-sealing, Bonding frame to display surface, Bonding components.
4723 Glass, LCD, Plastics 900 - 1,100 cps Clear 1.497 700 - 950 psi 68D - 70D Optical display lamination. Touch screen assembly.


Micro-Speaker Assembly Adhesives

PARLITE range of adhesives cures in seconds to offer optimum performance for micro-speaker assembly including bonding, sealing and wire-fixing. These adhesives designed to improve quality of sounds and easy of production.

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Grade Substrates Viscosity @ 250C cps Color Tensile Strength psi Elongation % Shore Hardness Application
4731 Plastics 400 - 500 cps Clear 2,300 - 2,500 85 - 95 54D - 58D Speaker assembly, plastic housing assembly, flexible plastic lamination, appliance assembly.
4733 Plastics 40,000 - 50,00 cps Red 2,000 - 2,200 70 - 80 54D - 56D Micro-speaker membranes to housings, LCP bonding.
4734 Metals, Plastics 60,000 - 80,00 cps Red 2,100 - 2,300 110 - 120 50D - 52D Wire-Fixing, Contact sealing, Bonding coil to membrane in speaker assembly.


Smart Card, Dam & Fill Encapsulant

PARLITE offers UV curable encapsulant based on epoxy system for smart card technology to fill dam & fill.

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Grade Substrates Viscosity @ 250C cps Shore Hardness Volume Shrinkage Elongation Color Application
4741 Plastics 4,500 - 5,200 cps 78D - 80D 2 - 3 % 5 - 8 % Transparent Speaker assembly, plastic housing assembly, flexible plastic lamination, appliance assembly.
4743 Plastics 160,000 - 190,000 cps 60D - 62D 2 - 3 % 18 - 22 % Transparent Encapsulant for smart card technology. Dam for Dam & Fill.


Epoxy Adhesives for Electronic Assembly

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Parbond Grade Substrates Viscosity @ 250C cps Specific Gravity Tensile Strength psi Cure Mechanism Hardness Application
5717 Glass Epoxy 2,400 - 3,000 cps 1.36 1,800 - 2,100 30 minutes @ 80° C 78D - 80D One component epoxy adhesive. Ideal for heat sensitive devices such as image sensors and MMC.
5720 Metals, Ceramic 30,000 - 34,000 cps 1.51 2,000 - 2,200 15 seconds @ 150° C 82D - 84D Flip-chip applications on aluminum antennas.
5150 Metals, Ceramic, Glass-filled epoxy, Plastics 17,000 - 22,000 cps 1.15 2,100 - 2,300 5 minutes @ RT 72D - 75D Two component system. Wide variety of electronic assembly.


Structural Adhesives for Electronic Assembly

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Partite Grade Substrates Working Time Minutes Fixture Time Minutes Tensile Elongation % Shear Strength psi Mix Ratio Application
7419 Metals, Plastics, Composites 2 - 4 6 - 9 50 - 70 2,100 - 2,300 10:1 Two part structural adhesive for variety of electronic assembly. Fast cure speed.
5720 Metals, Plastics, Composites 4 - 6 12 - 15 20 - 30 3,200 - 3,750 1:1 Ideal for electronic enclosure application. Easy to use with fast cure speed.


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Adhesives for Electronic Assembly